Dage was founded in 1961 and is a market leader in its chosen markets of semiconductor and PCBA manufacture. It has an award winning portfolio of Bondtester and X-ray Inspection Systems for destructive and nondestructive mechanical testing and inspection of electronic components. It has an excellent, wholly owned distribution and support network of seven offices covering Europe, Japan, China, Singapore, and the United States, and maintains representative offices in other territories. With its self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages such as BGA, Chip Scale Packages (CSP) and other electronic components. More recently Nordson DAGE has been heavily involved in the testing of the newest technology 300 mm wafer bump shear. Dage was acquired by the Nordson Corp. in 2006. Visit www.nordson.com.